Advanced Surface Processing and Analysis by Vacuum Technologies

Led by: Viorel BRAIC
Fields: Mater. Sci. Chemistry & Synthesis
Institution: National Institute for Research and Development in Optoelectronics (INOE 2000)
Scientists/Total: 19/25
Keywords:  Thin film deposition, sputtering, sol-gel, PLD, evaporation, RE-doped glasses, bulk alloys, characterization, plasma surface processing , UHV physics.

The ReCAST activity is mainly related to:
* thin film Physical Vapor Deposition (dc, rf, pulsed bipolar magnetron sputtering, cathodic vacuum arc, thermal evaporation) with associated physical characterization methods;
* plasma surface treatments;
* ultrahigh vacuum (UHV) technologies, including leak detection by mass spectrometry;
* ion sources for ion assisted surface processing.

Thin film deposition research activities were developed in the last four years especially due to potential applications in material coatings and surface engineering. Ion assisted magnetron sputtering and cathodic vacuum arc were applied and developed preferentially. The Mass spectrometry helium leak detection, vacuum brazing and UHV physics and related technology are also landmarks of ReCAST at national level.

The development of the laboratory infrastructure was mainly focused on enhancing the existing thin film deposition and surface processing capabilities, resulting a complex, versatile, yet complementary laboratory infrastructure. Also, dedicated thin film characterization systems were purchased and installed to complete the infrastructure and make possible a quick and high quality evaluation of the processed samples.

The research Centre for Advanced Surface Processing and Analysis by Vacuum Technologies became Excellence Research Center, after a four years competitive process supervised by RELANSIN – a Romanian Research and Innovation Program.


Magnetron sputtering units:
ORION – AJA UHV deposition unit
OXI – AJA UHV deposition unit
Laboratory Octogon deposition unit
Laboratory magnetron deposition unit

Cathodic arc deposition unit

Thermal/ Electron beam evaporation unit

Plasma – nitridation unit

Surface investigation:
Nano SAM Lab S Scanning Auger Microscopy System (Omicron)
Surface profiling/mapping/mechanical stress measurement system Dektak 150
AFM/STM Microscopy System INNOVA VEECO
Auger Electron Spectroscopy (AES) – Modular PHY system
X-ray Difractometry
UV-VIS IR reflectrometry/transmitance measurement
Fourier Transform Infrared Spectroscopy – FT-IR
Hall Measurement System
Coatings micro-hardness measurement
Coatings adhesion measurement
Coatings surface energy measurements
Corrosion resistance measurements
Wear and COF measurements

Plasma investigation:
Electrical probes
RF mass spectrometry – with differential pumping
Optical emission spectroscopy (DC and pulsed plasma)

Vacuum technologies:
Mass spectrometry systems for He leak detection
Clean High Vacuum brazing unit
Edwards Calibration unit for vacuum gauges
Plasma/laser welding and manufacturing workshop

Access for surface characterization:
Rutherford Back Scattering (RBS)
X-ray photoelectron spectroscopy (XPS)
Energy-dispersive X-ray spectroscopy (EDX)
Scanning Electron Microscopy (SEM)



Str. Atomiştilor nr. 409, 077125
Măgurele, jud. Ilfov, România
Tel: +40 21 4575759
Fax: +40 21 4575759




0 Patents or Software


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